doc. no : qw0905- rev. : date : - 2006 22 - dec. a LH3130-PF round type led lamps LH3130-PF data sheet pb lead-free parts ligitek electronics co.,ltd. property of ligitek only
-30 note : 1.all dimension are in millimeter tolerance is 0.25mm unless otherwise noted. 2.specifications are subject to change without notice. package dimensions 75% 100% -60 directivity radiation part no. LH3130-PF 75%100% 25% 0 25%50% 50% 60 0 30 7.65 25.0min 1.0min 2.54typ + - 0.5 typ 1.5max ligitek electronics co.,ltd. property of ligitek only 4.75 page 1/5
t opr -40 ~ +85 operating temperature typical electrical & optical characteristics (ta=25 ) max. forward voltage @20ma(v) 2.6 note : 1.the forward voltage data did not including 0.1v testing tolerance. 2. the luminous intensity data did not including 15% testing tolerance. red emitted LH3130-PF gap part no material red diffused 6971.7 color lens peak wave length pnm min. storage temperature tstg -40 ~ +100 6.5 4.5 46 viewing angle 2 1/2 (deg) luminous intensity @ ma(mcd) typ. 10 min. ligitek electronics co.,ltd. property of ligitek only ratings peak forward current duty 1/10@10khz reverse current @5v power dissipation forward current parameter ir pd i fp i f symbol absolute maximum ratings at ta=25 a 10 40 mw 15 60 ma ma h unit page 2/5 spectral halfwidth ? nm 90 LH3130-PF part no.
r e l a t i v e i n t e n s i t y @ 2 0 m a 600 0.0 0.5 wavelength (nm) 700800900 ambient temperature( ) fig.5 relative intensity vs. wavelength fig.3 forward voltage vs. temperature f o r w a r d v o l t a g e @ 2 0 m a n o r m a l i z e @ 2 5 1.0 -20 -40 0.8 1.0 0.9 1.1 1.2 0.5 r e l a t i v e i n t e n s i t y @ 2 0 m a n o r m a l i z e @ 2 5 -20 ambient temperature( ) 80 60 40 20 0-40 100 0.0 80 60 02040100 fig.4 relative intensity vs. temperature 2.5 1.5 1.0 2.0 3.0 fig.1 forward current vs. forward voltage typical electro-optical characteristics curve 100 f o r w a r d c u r r e n t ( m a ) 0.1 1.0 1.0 10 1000 h chip r e l a t i v e i n t e n s i t y n o r m a l i z e @ 2 0 m a forward voltage(v) 2.03.04.05.01.0 0.0 1.5 1.0 0.5 2.0 2.5 forward current(ma) 101001000 fig.2 relative intensity vs. forward current 3.0 ligitek electronics co.,ltd. property of ligitek only 1000 3/5 page LH3130-PF part no.
page 4/5 2.wave soldering profile soldering condition(pb-free) 1.iron: soldering iron:30w max temperature 350 c max soldering time:3 seconds max(one time only) distance:2mm min(from solder joint to body) ligitek electronics co.,ltd. property of ligitek only 150 time(sec) 260 c3sec max 260 temp( c) 2 /sec max 100 50 preheat 120 25 0 0 note:1.wave solder should not be made more than one time. 2.you can just only select one of the soldering conditions as above. 5 /sec max dip soldering preheat: 120 c max preheat time: 60seconds max ramp-up 2 c/sec(max) ramp-down:-5 c/sec(max) solder bath:260 c max dipping time:3 seconds max distance:2mm min(from solder joint to body) 60 seconds max LH3130-PF part no.
reference standard mil-std-750: 1026 mil-std-883: 1005 jis c 7021: b-1 mil-std-883:1008 jis c 7021: b-10 jis c 7021: b-12 mil-std-202: 107d mil-std-750: 1051 mil-std-883: 1011 mil-std-202: 210a mil-std-750: 2031 jis c 7021: a-1 mil-std-202:103b jis c 7021: b-11 mil-std-202: 208d mil-std-750: 2026 mil-std-883: 2003 jis c 7021: a-2 test item operating life test reliability test: 1.under room temperature 2.if=20ma 3.t=1000 hrs (-24hrs, +72hrs) test condition high temperature storage test low temperature storage test thermal shock test solder resistance test high temperature high humidity test 1.t.sol=260 5 2.dwell time= 10 1sec. 1.ta=105 5 &-40 5 (10min) (10min) 2.total 10 cycles 1.ta=65 5 2.rh=90%~95% 3.t=240hrs 2hrs 1.ta=-40 5 2.t=1000 hrs (-24hrs, +72hrs) 1.ta=105 5 2.t=1000 hrs (-24hrs, +72hrs) solderability test 1.t.sol=230 5 2.dwell time=5 1sec this test intended to see soldering well performed or not. the purpose of this test is the resistance of the device under tropical for hours. this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. ligitek electronics co.,ltd. property of ligitek only this test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. the purpose of this is the resistance of the device which is laid under condition of high temperature for hours. the purpose of this is the resistance of the device which is laid under condition of low temperature for hours. description page 5/5 LH3130-PF part no.
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